In the early 1990’s, the engineers at Zephyrtronics cleverly had the foresight to resolve the issue of placing BGA’s to the PCB pads. Their patented invention and method, now used successfully and repeatedly by thousands of engineers and technicians around the world, makes aligning the BGA component to the BGA pads:

1) Easy to Perform. (Little Skill Required)
2) Quick to Perform. It takes less than one minute!
3) Accurate & Repeatable Placement
4) Inexpensive and Kind to Your Budget!

Our patent-protected Zephyrtronics BGA Alignment Template Cube Invention eliminates the need for expensive so-called “split-beam” vision machines, cameras and monitors, all of which (by the way) must be continuously calibrated.

Below are photographs from Zephyrtronics and from NASA in a five step process for aligning and reflowing the BGA to the PCB pads.

STEP 1:
Insert the Patented Alignment Cube into Corresponding, Non-Heated Nozzle.  Activate ZT-7’s Vacuum to Secure Cube.

STEP 2:
Lower “Z” Axis of ZT-7 To Where Alignment Cube Hovers Directly Over (NASA Recommends About 1mm Above) the Targeted BGA Pads on the PCB Below.

STEP 3:
“Align the PCB’s pads for the targeted BGA to the Alignment Tool by adjusting the ABC-1 Circuit Board Cradle as necessary.”
 ---NASA, 2004

Photo Courtesy of NASA

STEP 4A:
Square and Mate Cube to Outside Perimeter of BGA Pads. The Nozzle’s X, Y and Theta are Now Precisely Relationed to Targeted BGA Pads! Cube Temporarily “Holds Place” for the BGA. Raise “Z” Axis, Deactivate Vacuum Releasing Cube.

STEP 4B:
That’s right! You don’t need a ten-twenty thousand dollar “split-beam” vision alignment unit to accurately place BGA’s and CSP’s (micro BGA’s) to your PCB pads!

In fact, NASA explains the simplicity this way: “ The alignment process is completed when the solder pads are just hidden on all directions. The drawing (on the left) shows what a properly aligned 5 x 5 BGA would look like. The solder pads (red) are just contained the Alignment Tool outline (blue).”
--NASA, 2004.

Graphic Illustration Courtesy of NASA from NASA Report Describing Zephyrtronics patented BGA Alignment Invention & Method.

STEP 5:
Insert Your BGA/CSP into the Now-Aligned Nozzle Where the Cube Had Been. Activate Vacuum to secure BGA. Lower “Z” Axis and Nozzle Down to the Substrate. Release Vacuum. Your BGA is Positioned on to Corresponding Pads! You are now ready to reflow your BGA with your Zephyrtronics ZT-7 System. How easy is that?

HOW TO RE-DRESS BGA & CSP PADS WITHOUT
THE USE OF HOT IRON & WICK!

STEP 1:
BGA removal requires cleanup as unequal solder deposits remain at vacated site. After IC removal, slide the “Y” Axis of ZT-7 back out of way, apply flux to pads. Preheat bottom of PCB at 150°C with AirBath.

STEP 2 (OPTION “A”):
After a brief preheating/soaking, use a heated DeSoldering Tool with a “soft tip-pad interface” and suck up excessive solder from pads. Preheating allows a lower, safer temp for DeSoldering.

STEP 2 (OPTION “B”):
Melt LowMelt® DeSolder into residual solder at pads. Remove all solder with either a foam swab or a “Solder Sucker”.

STEP 3:
Switch off ZT-7 and AirBath. Gently clean site with a foam swab and a Non-Flammable Flux Remover. Inspect. (Notice? No Wick!)